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d a t a sh eet objective speci?cation file under integrated circuits, ic02 2000 nov 22 integrated circuits TDA9181 integrated multistandard comb filter
2000 nov 22 2 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 features one-chip multistandard adaptive comb filter cross luminance reduction cross colour reduction no chroma trap, therefore sharper vertical luminance transients analog discrete-time signal processing, therefore no quantization noise anti-aliasing and reconstruction filters are included input switch selects between two y/cvbs inputs output switch selects between combed cvbs and an external y/c source f sc as well as 2 f sc colour subcarrier signal may be applied alignment free few external components low power. general description the TDA9181 is a an adaptive pal/ntsc comb filter with two internal delay lines, filters, clock control and input clamps. video standards pal b, g, h, d, i, m and n and ntsc m are supported. two cvbs input signals can be selected by means of an input switch. the selected cvbs input signal is filtered to obtain a combed luminance output signal and a combed chrominance output signal. switched capacitor circuit techniques are used, requiring an internal clock, locked on to the colour subcarrier frequency. the colour subcarrier frequency as well as twice the colour subcarrier frequency may be applied to the ic. in addition to the comb filter the circuit contains an output switch so that a selection can be made between the combed cvbs signal and an external y/c signal. the ic is available in a dip16 and so16 package. the supply voltage is 5 v. quick reference data ordering information symbol parameter min. typ. max. unit v cca analog supply voltage 4.5 5.0 5.5 v i cca analog supply current - 25 - ma v ddd digital supply voltage 4.5 5.0 5.5 v i ddd digital supply current - 10 - ma v i(y/cvbs)(p-p) luminance or cvbs input signal voltage (peak-to-peak value) 0.7 1.0 1.4 v v i(cin)(p-p) chrominance input signal voltage (peak-to-peak value) - 0.7 1.0 v v i(fsc)(p-p) colour subcarrier input signal voltage (peak-to-peak value) 100 200 400 mv v o(y/cvbs)(p-p) luminance or cvbs output signal voltage (peak-to-peak value) 0.6 1.0 1.54 v v o(cin)(p-p) chrominance output signal voltage (peak-to-peak value) - 0.7 1.1 v type number package name description version TDA9181p dip16 plastic dual in-line package; 16 leads (300 mil); long body sot38-4 TDA9181t so16 plastic small outline package; 16 leads; body width 7.5 mm sot162-1
2000 nov 22 3 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 this text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader .this text is here in _ white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader.this text is here inthis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader. white to force landscape pages to be ... block diagram handbook, full pagewidth mgt518 y/cvbs out c out 12 9 6 8 14 16 2 fsc fscsel v cca sandcastle detector clamp lpf lpf lpf clamp 11 sys1 10 sys2 15 outsel 13 agnd 4 dgnd 2h/4h delay adaptive comb filter y/cvbs 1 inpsel 3 y/cvbs 2 7 filter tuning (lpfs) 4 f sc clock generator sc 1 c in 5 v ddd TDA9181 fig.1 block diagram.
2000 nov 22 4 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 pinning symbol pin description c in 1 chrominance signal input inpsel 2 input switch select input y/cvbs 2 3 luminance or cvbs signal 2 input dgnd 4 digital ground v ddd 5 digital supply voltage v cca 6 analog supply voltage sc 7 sandcastle signal input fscsel 8 colour subcarrier select input fsc 9 colour subcarrier input signal sys2 10 standard select 2 input sys1 11 standard select 1 input y/cvbs 1 12 luminance or cvbs signal 1 input agnd 13 analog ground (signal reference) y/cvbs out 14 luminance or cvbs signal output outsel 15 output switch select input c out 16 chrominance signal output handbook, halfpage TDA9181p mgt519 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 c in inpsel y/cvbs 2 dgnd v ddd v cca sc fscsel fsc sys2 sys1 y/cvbs 1 agnd y/cvbs out outsel c out fig.2 pin configuration (dip16). handbook, halfpage TDA9181t mgt520 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 c in inpsel y/cvbs 2 dgnd v ddd v cca sc fscsel fsc sys2 sys1 y/cvbs 1 agnd y/cvbs out outsel c out fig.3 pin configuration (so16).
2000 nov 22 5 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 functional description input con?guration the y/cvbs 1 and y/cvbs 2 input signals are clamped by means of an internally generated clamp pulse which is derived from the sandcastle input signal (pin sc). if no sandcastle signal is available, a clamp pulse signal may be applied to pin sc. external clamp capacitors are needed. the buffered and clamped y/cvbs 1 and y/cvbs 2 signals are then applied to the input switch. the input switch select signal (inpsel) determines whether y/cvbs 1 or y/cvbs 2 is passed through to the anti-alias low-pass filter. this 3rd-order low-pass filter is optimized for best performance with respect to step response and clock suppression. the filtered signal is sampled at a clock frequency of four times the colour subcarrier frequency (f sc ). a colour subcarrier frequency signal is applied to pin fsc. the colour subcarrier select input signal (fscsel) indicates whether the colour subcarrier frequency (f sc )or twice the colour subcarrier frequency (2 f sc ) is being applied at the fsc input. an external coupling capacitor is needed for the colour subcarrier input signal. comb ?lter the sampled cvbs signal is applied to two delay lines. depending on the applied standard, one delay line delays the signal over 1 or 2h for ntsc and pal respectively (1h = one line-time). the standard select inputs sys1 and sys2 indicate which standard, pal b, g, h, d, i, m, n or ntsc m, is being applied. the direct and delayed signals are applied to an adaptive comb filter. the adaptive comb filter performs band-pass filtering around the colour subcarrier frequency and compares the contents of adjacent lines. in this way the combing of signals with different information is prevented and artifacts such as hanging dots are avoided. both the combed chrominance and the combed luminance signals are passed through a reconstruction low-pass filter to obtain continuous-time signals. these low-pass filters are 3rd-order, optimized for best performance with respect to step response and clock suppression. the reconstructed signals are applied to the output switches. output con?guration the luminance output switch selects between the reconstructed combed luminance signal and one of the buffered and clamped input signals, y/cvbs 1 or y/cvbs 2 . the chrominance output switch selects between the reconstructed combed chrominance signal and the chrominance input signal (c in ). an external coupling capacitor is needed for c in . the selected signals are applied to the outputs y/cvbs out and c out respectively via a buffer stage. the output switch signal (outsel) determines whether the output switches select the internal combed signals or the external y/c signals. clock generation and ?lter tuning the clock generator is driven by a phase-locked loop (pll) circuit which generates a reference frequency of four times the colour subcarrier frequency. this pll circuit is phase-locked to the colour subcarrier input signal (fsc). several internal clock signals are derived from the 4 f sc reference. the filter tuning ensures the automatic alignment of the anti-alias and the reconstruction low-pass filters. a 4 f sc clock signal is used as a reference for the alignment. the tuning takes place each line during the line blanking and is initiated by means of an internally generated signal which is derived from the sandcastle input signal. if the output switches select external y/c signals the oscillator of the pll circuit is stopped regardless of the fsc input and no internal clock signals are generated. the filter tuning is also stopped.
2000 nov 22 6 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 mode de?nitions table 1 general mode de?nitions; note 1 note 1. if the outsel pin is left open-circuit, the pin is pulled low by means of an internal pull-down resistor to analog ground (agnd). thus the comb mode can also be selected by not connecting the outsel pin. table 2 y/cvbs out output signal de?nitions table 3 c out output signal de?nitions table 4 input switch mode de?nitions; note 1 note 1. if the inpsel pin is left open-circuit, the pin is pulled low by means of an internal pull-down resistor to analog ground (agnd). thus the y/cvbs 1 input can also be selected by not connecting the inpsel pin. table 5 fsc mode de?nitions; note 1 note 1. if the fscsel pin is left open-circuit, the pin is pulled low by means of an internal pull-down resistor to analog ground (agnd). thus the f sc mode can also be selected by not connecting the fscsel pin. table 6 video standard mode de?nitions; note 1 note 1. if the sys1 and sys2 pins are left open-circuit, the sys1 pin is pulled high by means of an internal pull-up resistor to analog supply (v cca ) and the sys2 pin is pulled low by means of an internal pull-down resistor to analog ground (agnd). thus the ntsc m video standard can also be selected by not connecting pins sys1 and sys2. pin outsel mode low comb high yc mode y/cvbs out output signal comb comb ?ltered luminance signal yc y/cvbs 1 or y/cvbs 2 signal mode c out output signal comb comb ?ltered chrominance signal yc c in signal pin inpsel input switch mode low y/cvbs 1 input selected high y/cvbs 2 input selected pin fscsel fsc input signal frequency low f sc high 2 f sc pin sys1 pin sys2 video standard low low pal m low high pal b, g, h, d or i high low ntsc m high high pal n
2000 nov 22 7 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 limiting values in accordance with the absolute maximum rating system (iec 60134). notes 1. all pins are protected against esd by means of internal clamping diodes. 2. human body model (hbm): r = 1.5 k w ; c = 100 pf. 3. pin 5 (v ddd ) and pin 6 (v cca ): hbm: - 1500vTDA9181p 75 k/w TDA9181t 95 k/w
2000 nov 22 8 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 characteristics v cca =v ddd =5v; t amb =25 c; input signal y/cvbs 1 = 1 v (p-p); input signal y/cvbs 2 = 1 v (p-p); input signal c in = 0.7 v (p-p); input signal fsc = 200 mv (p-p) sine wave at f sc ; input signal s c=5v (p-p) sandcastle signal; test signal: 100/0/75/0 ebu colour bar for pal b, g, h, d, i and n, 100% white 75% amplitude fcc colour bar for ntsc m and pal m; source impedance for y/cvbs 1 and y/cvbs 2 =75 w , coupled with 10 nf; source impedance for c in and fsc = 75 w , coupled with 100 nf; load impedance for cvbs/y out and c out = 15 pf to analog ground (pin agnd); all voltages are related to analog ground (pin agnd); unless otherwise speci?ed. symbol parameter conditions min. typ. max. unit supplies v cca analog supply voltage 4.5 5.0 5.5 v i cca analog supply current - 25 - ma v ddd digital supply voltage 4.5 5.0 5.5 v i ddd digital supply current - 10 - ma p power dissipation - 175 - mw luminance or cvbs input 1 and input 2; pins y/cvbs 1 and y/cvbs 2 v i(y/cvbs)(p-p) luminance or cvbs input voltage (peak-to-peak value) including sync 0.7 1.0 1.4 v t clamp(y/cvbs) clamp time constant - 20 - lines i i(y/cvbs) input current during clamping - 10 0 +10 m a during active video - 10 0 +10 na chrominance input; pin c in v i(cin)(p-p) chrominance input voltage (peak-to-peak value) - 0.7 1.0 v r i(cin) input resistance 30 -- k w colour subcarrier input; pin fsc v i(fsc)(p-p) subcarrier input voltage (peak-to-peak value) 100 200 400 mv d duty cycle square wave 40 50 60 % r i(fsc) input resistance 30 -- k w sandcastle input; pin sc v i(sc) sandcastle input voltage no clamping -- 3.3 v clamping 3.7 -- v t w pulse width clamping; note 1 2.6 --m s t w(rep) pulse rising edge position with respect to end of line-blanking; note 1 --- 2.6 m s r i(sc) input resistance 1 -- m w c i(sc) input capacitance -- 2pf input switch select input; pin inpsel v il low-level input voltage y/cvbs 1 selected -- 0.5 v v ih high-level input voltage y/cvbs 2 selected 2.0 -- v r i(inpsel) input resistance 100 -- k w c i(inpsel) input capacitance -- 2pf
2000 nov 22 9 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 output switch select input; pin outsel v il low-level input voltage comb mode -- 0.5 v v ih high-level input voltage yc mode 2.0 -- v r i(outsel) input resistance 100 -- k w c i(outsel) input capacitance -- 2pf colour subcarrier select input; pin fscsel v il low-level input voltage f sc at fsc input; note 2 -- 0.5 v v ih high-level input voltage 2 f sc at fsc input 2.0 -- v r i(fscsel) input resistance 100 -- k w c i(fscsel) input capacitance -- 2pf standard select inputs 1 and 2; pins sys1 and sys2 v il low-level input voltage -- 0.5 v v ih high-level input voltage 2.0 -- v r i(sys) input resistance 100 -- k w c i(sys) input capacitance -- 2pf luminance output; pin y/cvbs out v o(y/cvbsout)(p-p) luminance output signal (peak-to-peak value) including sync 0.6 1.0 1.54 v e g(y) luminance gain error - 1 0 +1 db b - 3db(y) - 3 db luminance bandwidth comb mode; palb,g,h,dandi 6 -- mhz comb mode; ntsc m, pal m and n 5 -- mhz yc mode 10 -- mhz t d(proc)(y) luminance processing delay comb mode; pal b, g, h, d and i; note 3 - 650 - ns comb mode; ntsc m, pal m and n; note 3 - 800 - ns yc mode - 15 - ns v clamp voltage level during clamping - 1.5 - v e bl black level error during blanking; note 4 - 10 0 +10 mv s/n luminance signal-to-noise ratio (1 v/v rms noise) unweighted; 200 khz to 5 mhz 56 -- db a ct crosstalk between different inputs 0 to 5 mhz --- 50 db f clk(res)(y) residues of clock frequencies in the luminance signal (v rms /1 v) comb mode; note 2 f=4 f sc --- 30 db f=2 f sc --- 30 db f = 1.33 f sc --- 30 db f=f sc --- 40 db symbol parameter conditions min. typ. max. unit
2000 nov 22 10 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 fsc res(yc) fsc residue in yc mode (v rms /1 v) f=f sc ; f sc at fsc input; note 2 --- 60 db f=2 f sc ;2 f sc at fsc input --- 60 db a ct crosstalk suppression at vertical transient black ? multi-burst [1 v/v (p-p)] vertical transition active video ? vertical blanking; figs 6 and 7; note 5 26 -- db sup comb(y) suppression (comb depth) with respect to luminance band-pass nearest to f sc comb mode; palb,g,h,dandi; note 2 and fig.8 f=f sc 30 -- db - 10 - db - 10 - db comb mode; pal m; note 2 and fig.9 f=f sc 30 -- db - 10 - db - 10 - db comb mode, pal n; see note 2 and fig.10 f=f sc 30 -- db - 10 - db - 10 - db comb mode, ntsc m; see note 2 and fig.11 f=f sc 30 -- db - 10 - db - 10 - db r o output resistance -- 500 w z l load impedance -- 15 pf symbol parameter conditions min. typ. max. unit f 283.75 74 C 283.75 ------------------------------ - f sc = f 283.75 74 + 283.75 ------------------------------ - f sc = f 227.25 59 C 227.25 ------------------------------ - f sc = f 227.25 59 + 227.25 ------------------------------ - f sc = f 229.25 59 C 229.25 ------------------------------ - f sc = f 229.25 59 + 229.25 ------------------------------ - f sc = f 227.5 59 C 227.5 --------------------------- f sc = f 227.5 59 + 227.5 --------------------------- - f sc =
2000 nov 22 11 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 chrominance output; pin c out v o(cout)(p-p) chrominance output signal (peak-to-peak value) - 0.7 1.1 v e g(chrom) chrominance gain error - 1 0 +1 db b - 3db(chrom) - 3 db chrominance bandwidth comb mode, around f sc ; note 2 1.5 -- mhz yc mode; base-band 10 -- mhz d t (proc)(y) difference with luminance processing delay - 020ns v dc dc voltage level - 1.5 - v s/n chrom chrominance signal-to-noise ratio (0.7 v/v rms noise) unweighted; f sc 0.3f sc ; note 2 56 -- db a ct crosstalk between different inputs 0 to 5 mhz --- 50 db f clk(res)(chrom) residues of clock frequencies in the chrominance signal (v rms /0.7 v) comb mode; note 2 f=4 f sc --- 30 db f=2 f sc --- 30 db f = 1.33 f sc --- 40 db f=f sc --- 50 db fsc res(yc) fsc residue in yc mode (v rms /0.7 v) f=f sc ; f sc at fsc input; note 2 --- 60 db f=2 f sc ;2 f sc at fsc input --- 60 db a ct crosstalk suppression at vertical transient no-colour colour [0.7 v/v (p-p)] vertical transition active video ? vertical blanking; see figs 6 and 7 and note 6 26 -- db symbol parameter conditions min. typ. max. unit
2000 nov 22 12 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 sup comb(chrom) suppression (comb depth) with respect to chrominance band-pass at f = f sc comb mode; palb,g,h,dandi; note 2 and fig.12 30 -- db 30 -- db 30 -- db comb mode; pal m; see note 2 and fig.13 30 -- db 30 -- db 30 -- db comb mode; pal n; see note 2 and fig.14 30 -- db 30 -- db 30 -- db comb mode; ntsc m; see note 2 and fig.15 30 -- db 30 -- db 30 -- db r o output resistance -- 500 w z l load impedance -- 15 pf symbol parameter conditions min. typ. max. unit f 284 283.75 ----------------- - f sc = f 284 74 C 283.75 ---------------------- f sc = f 284 74 + 283.75 ---------------------- - f sc = f 227 227.25 ----------------- - f sc = f 227 59 C 227.25 ---------------------- f sc = f 227 59 + 227.25 ---------------------- - f sc = f 229 229.25 ----------------- - f sc = f 229 59 C 229.25 ---------------------- f sc = f 229 59 + 229.25 ---------------------- - f sc = f 227 227.5 -------------- - f sc = f 227 59 C 227.5 ---------------------- f sc = f 227 59 + 227.5 ---------------------- - f sc =
2000 nov 22 13 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 notes 1. the pulse should fall inside the line-blanking interval, after the rising edge of the synchronizing pulse. 2. f sc = colour subcarrier frequency; f sc = 4.43361875 mhz for the pal b, g, h, d and i systems; f sc = 3.57561149 mhz for the pal m system; f sc = 3.58205625 mhz for the pal n system; f sc = 3.579545 mhz for the ntsc m system. 3. for pal b, g, h, d and i: with respect to 567.5 colour subcarrier periods (equals 128.00 m s) due to 2h delay in the comb filter. for pal m: with respect to 454.5 colour subcarrier periods (equals 127.11 m s) due to 2h delay in the comb filter. for pal n: with respect to 458.5 colour subcarrier periods (equals 128.00 m s) due to 2h delay in the comb filter. for ntsc m: with respect to 227.5 colour subcarrier periods (equals 63.556 m s) due to 1h delay in the comb filter. 4. with respect to the voltage level during clamping. 5. test signal for pal b, g, h, d, i and n: ccir-18 multi-burst (see fig.4). for pal m and ntsc m: 100% amplitude fcc multi-burst (see fig.5). 6. test signal for pal b, g, h, d, i and n: 100/0/75/0 ebu colour bar. for pal m and ntsc m: 100% white 75% amplitude fcc colour bar. handbook, full pagewidth mgt521 (v) 0.5 1.0 2.0 3.8 4.8 5.8 mhz 1 0 0.30 0.15 0.44 0.45 0.65 0.86 fig.4 ccir-18 multi-burst.
2000 nov 22 14 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 handbook, full pagewidth mgt522 (v) 0.5 1.5 2.0 3.0 3.58 4.1 mhz 1 0 0.30 0.15 0.45 0.65 fig.5 100% amplitude fcc multi-burst.
2000 nov 22 15 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 handbook, full pagewidth mgt523 line n - 2 input line n - 1 line n + 1 line n + 2 line n + 3 line n line n - 2 output line n - 1 line n + 1 line n + 2 line n + 3 line n transition at top of field crosstalk crosstalk crosstalk crosstalk line n - 2 input line n - 1 line n + 1 line n + 2 line n + 3 line n line n - 2 output line n - 1 line n + 1 line n + 2 line n + 3 line n transition at bottom of field fig.6 vertical transitions active video ? vertical blanking from line to line (pal systems). handbook, full pagewidth mgt524 line n - 2 input line n - 1 line n + 1 line n + 2 line n + 3 line n line n - 2 output line n - 1 line n + 1 line n + 2 line n + 3 line n transition at top of field crosstalk crosstalk line n - 2 input line n - 1 line n + 1 line n + 2 line n + 3 line n line n - 2 output line n - 1 line n + 1 line n + 2 line n + 3 line n transition at bottom of field fig.7 vertical transitions active video ? vertical blanking from line to line (ntsc system).
2000 nov 22 16 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 handbook, full pagewidth mgt525 1 v uuvu y 0 detailed view comb depth at f = f sc 1 f sc 2 f sc y 0.5 0 1 0.5 0 283 283.75 f sc 283.25 283.75 f sc 283.5 283.75 f sc 283.75 283.75 f sc 284 283.75 f sc 284.25 283.75 f sc 284.5 283.75 f sc 284.75 283.75 f sc 282.75 283.75 f sc fig.8 luminance transfer characteristic (pal b, g, h, d and i systems).
2000 nov 22 17 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 handbook, full pagewidth mgt526 1 v uuvu y 0 detailed view comb depth at f = f sc 1 f sc 2 f sc y 0.5 0 1 0.5 0 226.5 227.25 f sc 226.75 227.25 f sc 227 227.25 f sc 227.25 227.25 f sc 227.5 227.25 f sc 227.75 227.25 f sc 228 227.25 f sc 228.25 227.25 f sc 226.25 227.25 f sc fig.9 luminance transfer characteristic (pal m system).
2000 nov 22 18 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 handbook, full pagewidth mgt527 1 v uuvu y 0 detailed view comb depth at f = f sc 1 f sc 2 f sc y 0.5 0 1 0.5 0 228.5 229.25 f sc 228.75 229.25 f sc 229 229.25 f sc 229.25 229.25 f sc 229.5 229.25 f sc 229.75 229.25 f sc 230 229.25 f sc 230.25 229.25 f sc 228.25 229.25 f sc fig.10 luminance transfer characteristic (pal n system).
2000 nov 22 19 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 handbook, full pagewidth mgt528 1 c cccc yy 0 detailed view comb depth at f = f sc 1 f sc 2 f sc yy 0.5 0 1 0.5 0 226 227.5 f sc 226.5 227.5 f sc 227 227.5 f sc 227.5 227.5 f sc 228 227.5 f sc 228.5 227.5 f sc 229 227.5 f sc 229.5 227.5 f sc 225.5 227.5 f sc fig.11 luminance transfer characteristic (ntsc m system).
2000 nov 22 20 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 handbook, full pagewidth mgt529 1 y u y uv 0 detailed view 1 f sc 2 f sc uv 0.5 0 1 0.5 0 283 283.75 f sc 283.25 283.75 f sc 283.5 283.75 f sc 283.75 283.75 f sc comb depth at f = 284 283.75 f sc 284 283.75 f sc 284.25 283.75 f sc 284.5 283.75 f sc 282.75 283.75 f sc fig.12 chrominance transfer characteristic (pal b, g, d, h and i systems).
2000 nov 22 21 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 handbook, full pagewidth mgt530 1 yy uv 0 detailed view 1 f sc 2 f sc uv 0.5 0 1 0.5 0 226.5 227.25 f sc 226.75 227.25 f sc 227 227.25 f sc 227.25 227.25 f sc comb depth at f = 227 227.25 f sc 227.5 227.25 f sc 227.75 227.25 f sc 228 227.25 f sc 226.25 227.25 f sc fig.13 chrominance transfer characteristic (pal m system).
2000 nov 22 22 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 handbook, full pagewidth mgt531 1 yy uv 0 detailed view 1 f sc 2 f sc uv 0.5 0 1 0.5 0 228.5 229.25 f sc 228.75 229.25 f sc 229 229.25 f sc 229.25 229.25 f sc comb depth at f = 229 229.25 f sc 229.5 229.25 f sc 229.75 229.25 f sc 230 229.25 f sc 228.25 229.25 f sc fig.14 chrominance transfer characteristic (pal n system).
2000 nov 22 23 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 handbook, full pagewidth mgt532 1 yyyy cc 0 detailed view 1 f sc 2 f sc cc 0.5 0 1 0.5 0 226 227.5 f sc 226.5 227.5 f sc 227 227.5 f sc 227.5 227.5 f sc comb depth at f = 227 227.5 f sc 228 227.5 f sc 228.5 227.5 f sc 229 227.5 f sc 225.5 227.5 f sc fig.15 chrominance transfer characteristic (ntsc m system).
2000 nov 22 24 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 application information handbook, full pagewidth mgt533 220 m h 100 nf c1 10 nf c3 l5 220 m h l6 5 v 100 nf c4 TDA9181 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 c in inpsel y/cvbs 2 sc fscsel fsc sys2 sys1 y/cvbs 1 y/cvbs out outsel c out 10 nf c12 100 nf 100 nf c9 c6 fig.16 application diagram.
2000 nov 22 25 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 package outlines references outline version european projection issue date iec jedec eiaj sot38-4 92-11-17 95-01-14 m h c (e ) 1 m e a l seating plane a 1 w m b 1 b 2 e d a 2 z 16 1 9 8 e pin 1 index b 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. unit a max. 12 b 1 (1) (1) (1) b 2 cd e e m z h l mm dimensions (inch dimensions are derived from the original mm dimensions) a min. a max. b max. w m e e 1 1.73 1.30 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 0.76 4.2 0.51 3.2 inches 0.068 0.051 0.021 0.015 0.014 0.009 1.25 0.85 0.049 0.033 0.77 0.73 0.26 0.24 0.14 0.12 0.01 0.10 0.30 0.32 0.31 0.39 0.33 0.030 0.17 0.020 0.13 dip16: plastic dual in-line package; 16 leads (300 mil) sot38-4
2000 nov 22 26 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z y w v q references outline version european projection issue date iec jedec eiaj mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 sot162-1 8 16 w m b p d detail x z e 9 1 y 0.25 075e03 ms-013 pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.41 0.40 0.30 0.29 0.050 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 x q a a 1 a 2 h e l p q e c l v m a (a ) 3 a 0 5 10 mm scale so16: plastic small outline package; 16 leads; body width 7.5 mm sot162-1 97-05-22 99-12-27
2000 nov 22 27 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 soldering introduction this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. wave soldering can still be used for certain surface mount ics, but it is not suitable for fine pitch smds. in these situations reflow soldering is recommended. through-hole mount packages s oldering by dipping or by solder wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joints for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg(max) ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. m anual soldering apply the soldering iron (24 v or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. surface mount packages r eflow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 220 c for thick/large packages, and below 235 c for small/thin packages. w ave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. m anual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
2000 nov 22 28 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 suitability of ic packages for wave, re?ow and dipping soldering methods notes 1. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 2. for sdip packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. these packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 5. wave soldering is only suitable for lqfp, qfp and tqfp packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. wave soldering is only suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. mounting package soldering method wave reflow (1) dipping through-hole mount dbs, dip, hdip, sdip, sil suitable (2) - suitable surface mount bga, lfbga, sqfp, tfbga not suitable suitable - hbcc, hlqfp, hsqfp, hsop, htqfp, htssop, sms not suitable (3) suitable - plcc (4) , so, soj suitable suitable - lqfp, qfp, tqfp not recommended (4)(5) suitable - ssop, tssop, vso not recommended (6) suitable -
2000 nov 22 29 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 data sheet status note 1. please consult the most recently issued data sheet before initiating or completing a design. data sheet status product status definitions (1) objective speci?cation development this data sheet contains the design target or goal speci?cations for product development. speci?cation may change in any manner without notice. preliminary speci?cation quali?cation this data sheet contains preliminary data, and supplementary data will be published at a later date. philips semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. product speci?cation production this data sheet contains ?nal speci?cations. philips semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2000 nov 22 30 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 notes
2000 nov 22 31 philips semiconductors objective speci?cation integrated multistandard comb ?lter TDA9181 notes
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20052 monza (mi), tel. +39 039 203 6838, fax +39 039 203 6800 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108-8507, tel. +81 3 3740 5130, fax. +81 3 3740 5057 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381, fax +9-5 800 943 0087 middle east: see italy netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. +31 40 27 82785, fax. +31 40 27 88399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. +64 9 849 4160, fax. +64 9 849 7811 norway: box 1, manglerud 0612, oslo, tel. +47 22 74 8000, fax. +47 22 74 8341 pakistan: see singapore philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland : al.jerozolimskie 195 b, 02-222 warsaw, tel. +48 22 5710 000, fax. +48 22 5710 001 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: lorong 1, toa payoh, singapore 319762, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 58088 newville 2114, tel. +27 11 471 5401, fax. +27 11 471 5398 south america: al. vicente pinzon, 173, 6th floor, 04547-130 s?o paulo, sp, brazil, tel. +55 11 821 2333, fax. +55 11 821 2382 spain: balmes 22, 08007 barcelona, tel. +34 93 301 6312, fax. +34 93 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 5985 2000, fax. +46 8 5985 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2741 fax. +41 1 488 3263 taiwan: philips semiconductors, 5f, no. 96, chien kuo n. rd., sec. 1, taipei, taiwan tel. +886 2 2134 2451, fax. +886 2 2134 2874 thailand: philips electronics (thailand) ltd., 60/14 moo 11, bangna trad road km. 3, bagna, bangkok 10260, tel. +66 2 361 7910, fax. +66 2 398 3447 turkey: yukari dudullu, org. san. blg., 2.cad. nr. 28 81260 umraniye, istanbul, tel. +90 216 522 1500, fax. +90 216 522 1813 ukraine : philips ukraine, 4 patrice lumumba str., building b, floor 7, 252042 kiev, tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 208 730 5000, fax. +44 208 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381, fax. +1 800 943 0087 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 3341 299, fax.+381 11 3342 553 printed in the netherlands 753504/25/01/pp 32 date of release: 2000 nov 22 document order number: 9397 750 07313

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